| 摘要 |
PURPOSE:To prevent the occurrence of void or inperfect filling in the finished molded product in transfer molding by providing the pressure-reducing mechanism reducing the pressure in the locking chamber of tablet more low than the atmospheric pressure in the molding machine operated by tablet molding process. CONSTITUTION:The die 1 molding the side surface of a locking chamber and upper and lower punches 2, 2 are provided, and the sliding ring 7 for preventing the leakage of epoxy resin and the leakage of vacuum is wound around the punch. First, in the stat e of the upper punch being retracted, raw material powder or particle 3 is introduced in the locking chamber. The air in the locking chamber is sucked by a rotary pump 6 from the air port 4 provided through the part of of a die from the time when the sliding ring of the upper punch comes down to the position engaging with the die. A filter 5 prevents the flowing into of powder. When a semiconductor device is transfer-molded by using the tablet obtained in such pressure-molding, imperfect filling and void in the resin part of the finished semiconductor device may be reduced. |
