| 摘要 |
PURPOSE:To unnecessitate heat treatment as well as to enhance the electric characteristics and the solderability of the title thermistor by a method wherein nickel-tin-boron alloy or a nickel-tungsten-boron alloy plating is opposingly provided on the surface of a barium titanate semiconductor porcelain thermistor. CONSTITUTION:Nickel-tin-boron or nickel-tungsten-boron alloy plating is opposingly provided on the surface of a barium titanate semiconductor porcelain thermistor. The nickel-tin-boron alloy plating is formed by adding stannic acid- gluconic acid complex as a reducing agent to an aqueous solution containing nickel salt and sodium borohydride or dimethylamine tin and boron. The nickel- tungsten-boron alloy plating is formed by adding a tungsten acid-gluconic acid complex as a reducing agent to an aqueous solution containing nickel salt, sodium borohydride tin and borane. As a result, a heat treatment process is unnecessitated, and the electric characteristics and the solderability of the title thermistor can be enhanced. |
