| 摘要 |
PURPOSE:To eliminate defects due to the variability of the thickness of contact boards so as to improve an overall yield by a method wherein the bonding of the contact board and a main board is made through a bonding agent composed of solder, anisotropic conductive material and the like. CONSTITUTION:A bonding material such as solder 11, used for the purpose of providing an electrically conductive means, is applied onto bonding lands 10 of a main board 3. Contact board 2 are so set as to make their bonding terminals 2 face toward the bonding lands 10, which are heated in a heating oven or the like under a specified condition, the bonding terminals 7 and the bonding lands are bonded together through the molten solder 11, and the substrates 2 and 3 are laminated for the formation of a laminar board 1. By this setup, defects caused by the variability of the thickness of the board 2 are eliminated, so that overall yield can be improved. |
