| 摘要 |
PURPOSE:To protect the rear side of a substrate against contamination by a method wherein one of printed thick film substrates produced in the same lot is made to serve as a paste contamination preventing substrate, and through- holes are made to be coincident with each other when the printed thick film substrate and the paste contamination preventing substrate are laid overlapping each other. CONSTITUTION:One of printed thick film substrates 6 produced in the same lot is used as a paste contamination preventive substrate 7. The substrate 6 is overlapped with the substrate 7 making through-holes 11 coincident with each other and fixed. Thick film paste is printed inside the through-hole 11 through sucking the paste into the through-hole 11 by reducing the air pressure on the substrate 7 side. Then, even if the paste is printed as being sucked into the through-hole 11, the excessive paste is almost sucked toward the suction hole of the board 7. By these processes, the through-holes 11 are made to coincide with each other when the substrates 6 and 7 are laid overlapping each other, so that the substrate 6 is prevented from being contaminated. |
