发明名称 MOLDING DIE EQUIPMENT FOR RESIN-SEALING SEMICONDUCTOR DEVICE
摘要 PURPOSE:To ensure a high-quality resin seating/molding process by a method wherein plural sets of positioning blocks with engagement between upper and lower blocks are provided on the top and bottom chase blocks of top and bottom forces for the prevention of the chase blocks on the top and bottom forces from horizontal displacement. CONSTITUTION:When top and bottom forces 41 and 51 are closed, top and bottom chase blocks 8 and 28 engage positioning blocks 59 and 49 in the direction X and positioning blocks 53 and 43 and positioning blocks 56 and 46 in the direction Y. With the device designed as such, in the presence of deformation in lower stationary beds 22 and 2 attributive to heat applied, there remains a good link between the chase blocks 8 and 18 without any relative displacement between the two in the directions X and Y. In this way, the blocks 8 and 28 are protected from horizontal displacement, which ensures a high-quality resin sealing/molding process.
申请公布号 JPH0249446(A) 申请公布日期 1990.02.19
申请号 JP19880200817 申请日期 1988.08.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 SAKAKIBARA JUNJI;TANAKA SUEKICHI
分类号 B29C45/02;B29C45/26;B29L31/34;H01L21/56 主分类号 B29C45/02
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