| 摘要 |
<p>PURPOSE:To prevent waterdrops from readhering to a semiconductor wafer after removal of the waterdrops by installing a circular fringe in accordance with the marginal shape of a semiconductor wafer in each slider, and positioning wafer holders to support the semiconductor from below in front and in rear of the transfer direction of the slider so as to fix them respectively. CONSTITUTION:By opening arms 5 and 5 after lowering the arms 5 and 5, a semiconductor wafer 1 on a transfer line 2 is introduced into a treatment part 3, and at the same time a semiconductor wafer 1' in which the treatment of waterdrop removal was applied at the treatment part 3 is placed on a carrying-out line 4 with the lowerings of the arms 5 and 5. After that, sliders 15 and 15 are slid in the reverse direction to the transfer direction through transfer cylinders 16 and 16 so as to position front wafer holders 17 and 17 at the sides of the semiconductor wafer 1 on the transfer line 2 and rear wafer holders 18 and 18 at the sides of the semiconductor wafer 1' in the treatment part, respectively, and by repeating it one after another, while applying waterdrop removal treatment to the semiconductor wafer 1 to which waterdrops adhering, the semiconductor wafer is transferred to the next process.</p> |
