| 摘要 |
PURPOSE:To prevent generation of a solder bridge so as to realize solder coating which is high in reliability in electronic parts by generating a get flow with solder solution, and soaking a substance to be coated in the jet flow in the condition that the flux liquid is covering the uppermost surface of the jet flow. CONSTITUTION:Solder solution 3 flows out in jet flow shape from a jet flow port 5 through a jet flow cylinder 4 by rotation of a propeller 6. Next, a flux liquid drop nozzle 10 stands above the jet flow port 5 and drops a specified amount of flux liquid 11 to the surface of the jet flow. The flux liquid 11 remains at the surface of the jet flow by a bank member 14a, and solder solution 3 flows out of the solder outflow port 15. During soaking of a substance 12 to be coated, the surface of solder solution 3 in jet flow condition is covered with the flux liquid 11 in the condition of being banked up by the bank member 14a, so the surface oxidation of the solder solution 3 is prevented, and also the outflow of the flux adhering to the surface of the substance 12 to be coated is prevented. |
