| 摘要 |
PURPOSE:To enable accurate and stable wire bonding, eliminate contact of a lead and a metal thin wire, and enable wire bonding to a suspension lead retaining a semiconductor element mounting stand part when die bonding process is performed by using Au-Si eutectic alloy, by fixing at least the inside of a bonding point of the lead by using insulator. CONSTITUTION:Leads 3 are fixed by using insulator 1, on the side of a semiconductor element 7 which is mounted in the inside of bonding points 2 of a plurality of the leads 3. For the insulator 1, ceramic or polyimide is used. By covering and fixing plurality of the leads 3, in the inside of the bonding points 2 by using the insulator 1, the following can be prevented; lead displacement at tip parts, including the bonding points 2 of a plurality of the leads 3, and the generation of irregularity and inclination. Further the generation of failure caused by contact of the bonding wire and the adjacent lead can be reduced. |
