| 摘要 |
PURPOSE:To facilitate a coating work resulting in the improvement of the productivity of a semiconductor device by a method wherein a semiconductor element is coated with a polyimide adhesive tape constituted by forming an Si adhesive layer on a polyimide film, and a substrate, the element and the tape are unitarily resin-sealed. CONSTITUTION:The numerals 5 and 5 are external connection leads, and 6 and 6 are bonding wires connecting the leads 5 and 5 to the semiconductor memory element 1. The polyimide adhesive tape 3 is constituted of a structure wherein the Si adhesive layer 3b is provided on the polyimide film 3a, and wherein the side of said adhesive layer 3b is adhered on the semiconductor memory element 1 by compression bonding. The thickness of the tape is generally 20mum or more, and preferably 30mum or more and 100mum or less. The greatest feature is that the semiconductor element 1 is coated with the polyimide adhesive tape 3, and this polyimide adhesive tape 3 has the function that the polyimide film 3a attenuates and absorbs the alpha ray emitted from the sealed resin 4. |
