| 摘要 |
PURPOSE:To prevent a metal thin wire from being adsorbed to a clamp plate due to static electricity by performing connection operation between a semiconductor chip and a lead while spraying ionized dry air to the metal thin wire. CONSTITUTION:An ionized air generation means 21 is activated on performing connection operation and an ionized dry air generated by the means 21 is sprayed to a part which is penetrated between clamp plates 7 and 7 of a metal thin wire 1 from a blow-off nozzle 25a. Static electricity electrifying the thin wire 1 for some reasons due to the ionized dry air is neutralized and the static electricity is lost. It prevents the thin wire 1 from being to the clamp plates 7 and 8 Which are placed closer to both sides due to static electricity. |
