发明名称 Isothermalised heat sink
摘要 The aim is to provide an isothermal heat sink, which is simple and inexpensive to produce, for cooling components which generate waste heat, in particular power semiconductors. For this purpose, the heat sink (1) has on its mounting side a groove (2) on top of which a semi-finished heat tube constructed as an elongated cover (6) is laid and welded to the groove (2) to form a complete heat tube. The groove (2) and cover (6) respectively have suitable internal surface structures (5a, 5b). <IMAGE>
申请公布号 DE3825981(A1) 申请公布日期 1990.02.15
申请号 DE19883825981 申请日期 1988.07.27
申请人 LICENTIA PATENT-VERWALTUNGS-GMBH, 6000 FRANKFURT, DE 发明人 HEINEMEYER, PETER, 1000 BERLIN, DE
分类号 F28D15/02;F28D15/04;H01L23/427 主分类号 F28D15/02
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