| 摘要 |
PURPOSE:To improve acid resistance, adhesion and solder heat resistance of an inner layer copper foil by treating the inner layer copper foil with a mixed solution of potassium persulfate, sodium hydroxide and sodium sulfate, thereafter forming a unitary body by laminating the inner layer and an outer layer material through a resin impregnated base material. CONSTITUTION:An inner layer copper foil is treated with a mixed solution of potassium persulfate, sodium hydroxide and sodium sulfate. Thereafter, a unitary body is formed by laminating the inner layer and an outer layer plate through a resin impregnated base material. As the resin for the resin impregnated material, synthetic resins such as phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide resin, polyphenylene oxide resin, fluororesin and the like are used. In this way, acid resistance of the inner copper foil, solder heat resistance and adhesion of the inner copper foil are improved. |
