| 摘要 |
<p>PURPOSE:To obtain a device wherewith the number of contacts involving wafers may be decreased for reduction in dust or flaws, time required for transfer may be shortened, and the process of replacement of carriers and boats may be dispensed with. CONSTITUTION:A wafer transfer device, which takes out wafers 5 accommodated vertically in a carrier 6 out of the carrier 6 and places the wafers 5 vertically in a boat, is provided with a support 2 wherein at least a pair of boat support pins 2a capable of detachably supporting the boat and a lift blade support pin 2b are planted facing each other with the shaft of rotation 2d between them; an inversion mechanism 2c capable of inverting upside down the boat support pins 2a and the lift blade 3 by turning the support 2; and a lift mechanism 3b capable of pushing up the lift blade 3 mounted with the wafers 5 accommodated in the carrier 6 so that the wafers 5 will be forwarded into between the boat support pins 2a and the lift blade support pin 2b, both belonging in the support 2.</p> |
