| 摘要 |
PURPOSE:To obtain a semiconductor device provided with an electrode junction structure quite high in reliability by a method wherein a metal ball bonded to a semiconductor chip electrode layer has a structure plastically deformed so that a continuously, gently changing concave surface is present at its connection with a metal wire. CONSTITUTION:This is a semiconductor device with a metal wire 2 bonded to a semiconductor chip electrode layer 8, wherein a metal ball 4 is formed at the end of the metal wire 2 and bonded to the electrode layer 8, an alloy layer 17 is formed along the boundary between the metal ball 4 and the electrode layer 8, and the metal ball 4 is so plastically deformed that there is a continuously, gently changing concave surface 15 on its connection with the metal wire 2. For example, an electrode junction of a structure described above may be embodied using a capillary chip 1 as illustrated. Such a capillary chip 1 should have, along the circumference of the opening at its end, a chamfering section 13 equipped with a convex surface continuously, gently changing from the inner wall of an insertion hole 22 toward a load plane 14. |
