| 摘要 |
<p>PURPOSE:To prevent a resistive film from recontact when it is cut by fusing by the generation of an excessive current as well as to obtain the title resistor having a uniform resistive film by a method wherein a load concentrating part is formed on the resistive film by conducting a trimming work, and said load-concentrating part is coated with the fusing material consisting of a low-melting point substance. CONSTITUTION:The objective chip type fuse resistor is composed of chip pieces 1, a resistive film 3 formed on the chips 1, and the upper electrodes 4 and 4 formed opposing to both ends of the chips 1 including the resistive film 3. A load concentration part 6 is formed on the resistive film 3 located between the upper electrodes 4 by trimming, and said concentration part 6 is covered with a fusable material 7 consisting of a low-melting point substance. For example, a resistive film 3 is formed on the activated layer 2 which is mainly composed of Pd by the non-electrolytic plating such as Ni-P and the like, and after the upper electrodes 4 and 4 have been formed at both ends of the film 3, a load concentration part 6 is formed on the resistive film 3 by laser trimming and the like, and the load concentration part is coated with a fusable material 7 consisting of glass or non-carbonizing resin. Besides, a protective coat 9 consisting of heatproof epoxy resin is formed on the resistive film 3 containing the fusable material 7.</p> |
