A composite structure for use in electronic packages.

摘要

Described is a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by changes in the dielectric structure between two levels of circuitry (12 and 15,16,17). This adjustment in the composite dielectric structure is accomplished by changes in the electrical properties of the composite dielectric material, one level (14) being preset to a value and the other level (13) being adjusted by alterations of predetermined amounts that depend upon the performance desired.