发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To standardize the kinds of packages, and to prevent the accidents of a short circuit by forming a concave section fitted to a maximum chip into the package and forming an auxiliary pad row along the pads of the end section of the package. CONSTITUTION:The concave section 211 fitted to the maximum chip is formed to the base 21 of the package, connections 4 are wired to auxiliary pads 6 disposed into the concave section at shortest distances when a small chip, and the accidents of short circuit due to the hang of wiring can be prevented. According to such constitution, unification through the standardization of the kinds of the packages is enabled, there happens no accident of a short circuit, and reliability is improved.
申请公布号 JPS58114444(A) 申请公布日期 1983.07.07
申请号 JP19810213989 申请日期 1981.12.26
申请人 FUJITSU KK 发明人 AKASAKI HIDEHIKO;TSUJIMURA TAKEHISA
分类号 H01L23/12;H01L21/52;H01L23/498 主分类号 H01L23/12
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