| 摘要 |
PURPOSE:To enable fast, high-accuracy positioning by using a frame structure consisting of a hollow pipe which is provided with a node internally, charging a material for increasing attenuation in the hollow pipe, and providing high rigidity and high attenuation. CONSTITUTION:A moving stage 2 where a wafer 1 is fixed is moved in a perpendicular plane by two couples of guide bars 3 and 4 and two stage driving motors 5 and 6 and positioned so that the wafer 1 is set at a specific baking position. The guide bars 4 are accurately fitted to the main frame 7 consisting of the hollow pipe. The main frame 7 is structured by combining hollow prismatic pipes, which are provided nodes 8 inside to have sufficient rigidity. Further, materials 10 with a high attenuation factor such as sands are charged in small rooms 9 in the main frame 7 which are partitioned by the nodes 8, thereby attenuating speedily the elastic deformation vibration of the main frame 7 due to the movement and stop of the moving stage. |
