发明名称 ELECTROPLATING TANK
摘要 PURPOSE:To obtain a dense plating layer having a smooth surface by passing a plating soln. through a penetrating hole in an anode plate, injecting the soln. onto a cathode, circulating the soln., and supplying the metal ion to be consumed in the vicinity of the cathode. CONSTITUTION:A member to be plated as the cathode plate 3 and the anode plate 2 having many penetrating holes 11 arranged in the form of a grille are provided in the electroplating tank in opposition to each other. The tank is filled with a plating soln. 9, and both electrodes 2 and 3 are dipped in the soln. The soln. 9 is jetted onto the cathode 3 through the holes 11. A plating soln. delivery mechanism is further provided, and the soln. 9 is circulated.
申请公布号 JPH0243399(A) 申请公布日期 1990.02.13
申请号 JP19880193834 申请日期 1988.08.02
申请人 NEC CORP 发明人 YAMAGATA TOSHIO
分类号 C25D17/00;C25D5/08;C25D21/10;H01L21/321;H01L21/60;H01R43/02;H05K3/24;H05K3/46 主分类号 C25D17/00
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