发明名称 |
Method and apparatus for encapsulating semi-conductors |
摘要 |
A resin-molded semiconductor is produced by using an apparatus which comprises a mold having a plurailty of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner, said cavities being filled with a molding resin fed under pressure from said pots, with a part to be molded placed in each cavity. The process and apparatus of this invention prevent the molding defects resulting from the excessive flow resistance of resin and greatly improves the use efficiency of resin.
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申请公布号 |
US4900501(A) |
申请公布日期 |
1990.02.13 |
申请号 |
US19860924773 |
申请日期 |
1986.10.30 |
申请人 |
HITACHI, LTD. |
发明人 |
SAEKI, JUNICHI;KANEDA, AIZO;OZAWA, MASAKAZU;NAKAGAWA, TAKASHI;NISHI, KUNIHIKO |
分类号 |
B29C45/02;B29C45/14;B29C45/26;B29L31/34;H01L21/56 |
主分类号 |
B29C45/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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