| 摘要 |
<p>PURPOSE:To shorten a sorting time by installing the following: a sheet-pasting process; a characteristic-measuring process of individual elements; a store and classification process of a measured result; a scribing process of a wafer; a wafer-breaking process; a sheet-stretching process; die-mounting process. CONSTITUTION:A wafer is pasted onto the surface of a sheet where an adhesive layer has been formed on its surface and a magnetic medium layer has been formed on its rear; individual characteristics of individual elements inside the wafer are measured by using a prober or the like. A measured result is stored in the magnetic medium layer situated on the rear of the individual elements; the wafer is scribed. The scribed wafer is broken; a sheet is stretched; spaces are formed in broken parts of the wafer. A good chip is discriminated on the basis of magnetic information; it is mounted in a prescribed position of a package. Thereby, it is possible to eliminate a drawback that a sorting time becomes long by a visual inspection of a human being.</p> |
