发明名称 ELECTROLESS GOLD PLATING LIQUID
摘要 PURPOSE:To obtain the electroless gold plating liquid which has excellent stability and high deposition rate of Au by adding at least one kinds of Pd compds. and Tl compds. and alcohols to an aq. soln. contg. a water soluble gold salt, reducing agent and alkali hydroxide as the electroless gold plating liquid. CONSTITUTION:The inorg. salts such as chloride and sulfate of the Pb and Tl or the org. salts of Pb and Tl such as lead citrate and thallium tartrate are incorporated into the aq. soln. of the compsn. essentially consisting of 1 or >=2 kinds of the water soluble gold compds. such as dicyano aurate, tetracyanoaurate and tetrachloroaurate, boron hydride compds. such as KBH4 and NaOH as the reducing agent of the gold compds., alkylamineborane compds., and alkali hydroxides such as KOH and NaOH as the electroless plating liquid of Au and further, the alcohols such as methanol, ethanol and propanol are added and incorporated thereto. The decomposition of the plating liquid by the metal ions eluted from the metallic material to be plated is suppressed and the electroless gold plating liquid having the high deposition rate of the Au is obtd.
申请公布号 JPH0243373(A) 申请公布日期 1990.02.13
申请号 JP19880193989 申请日期 1988.08.03
申请人 NIPPON MINING CO LTD 发明人 HANABUSA MIKIO;YOSHII TOSHIFUMI
分类号 C23C18/44 主分类号 C23C18/44
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