发明名称 |
PROCESS FOR THE PHOTOSELECTIVE METALLIZATION ON NON- CONDUCTIVE PLASTIC BASE MATERIALS |
摘要 |
<p>UNITED STATES PATENT APPLICATION OF DAVID C. FRISCH AND WILHELM WEBER FOR PROCESS FOR THE PHOTOSELECTIVE METALLIZATION ON NON-CONDUCTIVE PLASTIC BASE MATERIALS Catalytically imaged thermosetting and thermoplastic resin objects including printed circuit boards are provided. A hydrophilic, adhesion promoted insulating base material is treated in selected areas to produce metallic nuclei in the form of an image of a desired metal pattern. The image is exposed to an electroless metal bath to reinforce the image. Then, the non-imaged areas of the base are rendered hydrophobic by means of solvent treatment. The imaged areas are built up by metal deposition. Preferably, the solvent treatment of the non-imaged areas of the base material is repeated to enhance adhesion of the metal pattern to the base materiel.</p> |
申请公布号 |
CA1265698(A) |
申请公布日期 |
1990.02.13 |
申请号 |
CA19850490687 |
申请日期 |
1985.09.13 |
申请人 |
KOLLMORGEN TECHNOLOGIES CORPORATION |
发明人 |
FRISCH, DAVID C.;WEBER, WILHELM |
分类号 |
B29C35/08;C23C18/16;C23C18/20;C23C18/24;C23C18/26;C23C18/30;C23C18/31;C23C18/34;C23C18/40;C23C18/44;C23C18/52;H05K1/18;H05K3/18;(IPC1-7):G03F7/26 |
主分类号 |
B29C35/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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