Electronic apparatus having semiconductor device

摘要

Disclosed is an electronic apparatus, for example, an ignitor, wherein a large power consumption type semiconductor device (15) is mounted on a ceramic substrate (11) of sintered aluminum nitride with high thermal conductivity for improving a heat dissipation effect. The aluminum nitride-made ceramic substrate having the semiconductor device is provided in a metallic vessel (16) made of aluminum or the like. Employed is a thermal stress strain-resistant adhesive agent (17) with high thermal conductivity such as a silicone type adhesive agent for bonding. The thermal stress strain-resistant adhesive agent layer serves as a cushioning layer for a heating and cooling cycle and therefore improves a heat cycle resistance.