发明名称 MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To reduce a tensile force needed for a cutting operation and to prevent a sealed resin from being damaged during a breaking operation by a method wherein a non-connected part is formed in a connected narrow strip and every plural narrow strips in a lead frame are cut. CONSTITUTION:In a state that at least one non-connected part is formed in a connected narrow strip 11 and that the connected narrow strip in a lead frame has been divided, a tensile force in an extraction direction and toward the outside is exerted on a plurality of narrow strips 10 on one side of the non-connected part 16; the narrow strips are broken at a minimum cross-section part 15. In addition, a tensile force toward the outside is exerted on the plural narrow strips 10 on the side opposite to the one side of the non-connected part 16; the narrow strips are broken at the minimum cross-section part 15. Thereby, the narrow strips can be broken easily and satisfactory by means of the small tensile force without damaging a sealed resin.
申请公布号 JPH0242751(A) 申请公布日期 1990.02.13
申请号 JP19890150427 申请日期 1989.06.15
申请人 SANKEN ELECTRIC CO LTD 发明人 YOSHIDA SADAO
分类号 H01L23/48 主分类号 H01L23/48
代理机构 代理人
主权项
地址