发明名称 Process for the preparation of a multi-layer stacked junction typed thin film transistor using seperate remote plasma
摘要 A process for the preparation of a multi-layers stacked junction typed thin film transister of which electric amplification factor ( beta ) at the time of the base electrode or the emitter electrode being grounded is about 10 and which has an excellent amplifying operation. The process is characterized in that of least the base region is formed by introducing a precursor A generated by activating a gaseous raw material (i) containing at least silicon atom and halogen atom in an activation space (a), a precursor B generated by activating a gaseous raw material (ii) containing at least hydrogen atom in an activation space (6), and if necessary, a precursor C generates by activating a gaseous raw material (iii) containing at least Group III atom or Group V atom of the Periodic Table in either the activation space (a) or the activation space (b), or in an different activation space (c) into a film forming space having a substrate being maintained with a desired temperature therein and chemically reacting them to thereby form a polycrystal silicon film to constitute at least its base region.
申请公布号 US4900694(A) 申请公布日期 1990.02.13
申请号 US19880171465 申请日期 1988.03.21
申请人 CANON KABUSHIKI KAISHA 发明人 NAKAGAWA, KATSUMI
分类号 G09F9/30;G02F1/136;G02F1/1368;H01L21/205;H01L21/331;H01L21/337;H01L29/73;H01L29/737 主分类号 G09F9/30
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