Apparatus for collecting wafers

摘要

An apparatus for collecting wafers sliced from a semiconductor crystal rod, and the apparatus includes a primary mobile member, a secondary mobile member and a wafer collection assembly. The primary mobile member is movable toward and away from the crystal rod, and the secondary mobile member is mounted on the primary mobile member and is movable relative to the primary mobile member in a direction toward and away from the semiconductor crystal rod. The wafer collecting assembly is mounted on the second mobile member for collecting the wafers sliced from the semiconductor crystal rod.