发明名称 FLUX-LESS SOLDERING METHOD AND DEVICE
摘要 <p>PURPOSE: To achieve the fluxless soldering using no silane by directing the gas having the prescribed momentum sufficient to wet the solder wettable surface with the molten solder of the prescribed temperature and not oxidized toward a mound to cool the molten solder. CONSTITUTION: A solder mound 2 is brought into contact with a surface 8 of an object 4 and a surface 10 of an object 6, and the surfaces 8, 10 are solder- wettable. The gas flow 12 is directed to a heater 14, and the heated gas flow 22 is at the high temperature sufficient to melt the solder mound 2. When the mound 2 is melted, oxides on a solid solder are afloat on the surface of the molten solder, the gas flow 22 is directed to the molten solder, and their momentum breaks the surface oxide in the non-oxidized solder and homogenizes the surface oxide when collided with the afloat oxide. The non-oxidized molten solder is brought into contact with the wettable surfaces 8, 10, and the part is then cooled, and the objects 4, 6 are joined with a solder part 24.</p>
申请公布号 JPH0241772(A) 申请公布日期 1990.02.09
申请号 JP19890155977 申请日期 1989.06.20
申请人 INTERNATL BUSINESS MACH CORP &lt,IBM&gt, 发明人 HARII RANDERU BITSUKUFUOODO;REIMONDO ROBAATO HOOTON;IZUMEIRU SEBUDETO NOOAN;MAIKERU JIYON PAAMAA;JIYOON CHIYAARUZU JIIZU
分类号 B23K1/012;H01L21/00;H01L21/60;H05K3/34 主分类号 B23K1/012
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