| 摘要 |
PURPOSE: To improve the heat radiation of chip elements and facilitate assembling by providing bending means capable of depressing a heat sink on a semiconductor device electrically connected to a first flexible circuit board on a first circuit board. CONSTITUTION: The electronic package 10 comprises a first circuit board 11, semiconductor device 13 e.g. Si chip electrically connected to the board 11, second flexible circuit board 12 electrically connected to the board 11, and semiconductor device 13 mounted on the bottom 19, including a heat sink 17 on the board 11. At assembling, the bottom 19 of the heat sink 17 and top 31 of the chip 13 are coated with adhesives, the heat sink 17 is pressed down to contact and adhere them and then lifted up to a working position with expansion/shrink of flexible means 41 disposed on the surface 27 of the board 11. |
