| 摘要 |
PURPOSE:To form a thick film circuit with high yield by forming a connecting conductor having a thickness substantially corresponding to the step of the edge of a viahole region or an insulator connected to a lower conductor by a direct lithography, and forming an upper conductor for connecting a plurality of connecting conductors by a direct lithography. CONSTITUTION:Lower conductors 83 are formed on a board 42, dried and baked. Then, insulators 82 are formed in a predetermined pattern, dried, and baked. In this case, viaholes 84 for connecting the independent conductor 83 is simultaneously formed. The thickness of the insulator 82 is considerably thicker than that of the conductor 83, and a large step is generated at the edges of the viahole 84 and the insulator 82. Then, a connecting conductor 11 of thickness substantially corresponding to the depth of the viahole 84 is formed at the part of the viahole 84. A connecting conductor 11' is also formed at a position for connecting the conductor 83 at a part having large step of the edge of the insulator 82. After the conductors 11, 11' are formed, they are dried and connected. Then, an upper conductor 81 is so formed by lithography as to connect the conductors 11, 11' formed in the viaholes 84, 84. |
