| 摘要 |
PURPOSE:To easily detect a break of a wire after bonding by a method wherein slit light is directed onto a wire, while a substrate and slit light are relatively moved and the wire is scanned with a slit image is from the pick-up direction having a fixed tilt angle to the irradiation direction of the slit light. CONSTITUTION:Slit light 8 is directed onto a substrate 1, while this slit light 8 is moved in the arrow direction in order to scan a slit image 10a in the substrate 1, a slit image 10b in the electron parts 4 and a slit image 10c in a wire 7. The respective images 10a, 10b are picked up from the shifted positions directly proportional to the height of a part to be irradiated by the slit light to the same slit light 8 so that the height data of that part can be obtained according to an amount of positional shift. Accordingly, in case the wire 7 is broken, the height data H2 becomes discontinuous at a broken spot so that a break of the wire 7 can be detected by noticing the continuity of the height data H2 ranging the whole wire length. |
