| 摘要 |
PURPOSE:To improve a bonding accuracy and realize a multi-position package by a method wherein first layer pads and second layer pads are formed in a same patterning process and mutual discrepancy is eliminated. CONSTITUTION:A recess is provided at the center inside a ceramic package 1 and an element mounting part 2 having a tungsten metallized layer is provided at the bottom of the recess. A first tungsten metallized layer 3 is provided on the flat plane of the upper stage of the recess and an alumina paste insulating film 4 is formed on the layer 3 except the tip part and a second tungsten metallized layer 5 is provided on the insulating film 4. Pads are provided around the element mounting part 2 by patterning tungsten pads 6a and 6b connected to the tip parts of the metallized layers 3 and 5 so as to overlap each other partially. The metallized layers 3 and 5 are connected to outer leads 7 piercing through the wall of the ceramic package 1 and drawn outside to constitute a semiconductor package. A semiconductor chip 8 is mounted on the element mounting part 2 and the electrodes of the semiconductor chip 8 are connected to the pads 6a and 6b with bonding wires 9. |
