| 摘要 |
PURPOSE:To improve the hermetical sealability of a space containing a mounting component and to prevent the component from deteriorating by covering a resin base integrally molded with a lead frame with a metal cap, and mounting a sealing material surrounding the component between a flat part and the base in the cap in a compressed state. CONSTITUTION:A space 15 is formed in a part surrounded by a base 12 in a cap 13, and circuit elements 16 such as an IC element, a light emitting element or a photodetector are mounted on the component mounting face of a lead frame 11 disposed near the space 15. The elements 16 are electrically connected by bonding wirings 17 to one ends of outer leads of the frame 11, and a light is propagated to the element 16 through a window 14 formed at the cap 13. A sealing material 18 formed in a frame state is so mounted with an elastic material such as rubber on the flat part of the base 12 as to surround the space 15 containing the elements 16. The cap 13 is so secured to the base 12 that the material 18 is interposed between the base 12 and the cap 13 to be compressed, and the hermetical sealability is held in the space 15 by the material 18. |
