| 摘要 |
PURPOSE:To obtain a lead frame having both advantages of an etching lead frame along with a film carrier by extending a plurality of inner leads to the inside of an opening part, and making the rear surface side of each lead from the tip to the vicinity of the center thinner than the other part. CONSTITUTION:The tip part of each inner lead 12 is extending to the inside of an opening part 11. The rear surface of the inner lead 12 from the tip to the vicinity of the center is scraped, and a thin layer part 12a which is made thinner than the other part is formed. The rear surface of the tip part of each inner lead which is extending to the inside of the opening part 11 is bonded to each bonding pad 17 on the surface of a semiconductor element 16 in a resin sealed type semiconductor device using such a lead frame. A resin sealing layer 18 is provided so as to cover said parts. Since each inner lead 12 is directly bonded to the bonding pad 17 of the semiconductor element 16, gold bonding wire is not required. Therefore, the resin sealed type semiconductor device can be obtained at a low cost with good productivity. In this way, the lead frame which is provided with the following advantages is obtained: decrease in manufacturing cost which is the advantage of etched lead frame; and a wireless configuration which is the advantage of a film carrier.
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