| 摘要 |
<p>A plane or 'board' (1) for use in the interconnection of a plurality of optical circuit devices (5) is disclosed. Each circuit device (5) will have attached at least one optical signal transmission fiber or rod (7, 10) for the express purpose of communication external to such device by optical means, as well as any means for the purpose of electrical signal transmission. Electrical interconnections are provided using traditional methods, including the use of soldering techniques. Optical interconnections are afforded by means of optical rods or filaments (7, 10) which originate in the circuit devices (5) themselves, and are joined to the optically conducting path of the circuit board (1) by use of either sonic or ultrasonic acoustical energy. The use of acoustical energy in this manner will produce a welded junction which couples optical signals between these two materials. This ultrasonic welding procedure can be accomplished using a handheld tool (16, 17), much as an electrical soldering iron is presently used.</p> |
