| 摘要 |
<p>PURPOSE:To shorten time required for conveying a wafer and improve the processing capacity of equipment for manufacturing semiconductor devices by providing a plurality of air lock chambers which make it possible to perform a simultaneous processing. CONSTITUTION:When the ascent of respective stages is complete, the first and second air lock chambers 8 and 9 are allowed to rise and an etched wafer 11 is taken out from the second air lock stage 3 to an unload cassette 7. Then, an unetched new wafer is delivered from a loaded cassette 6 to the first air lock stage 2 and further, etching sets in at an etching chamber 10. Two sheets of wafers are thus processed simultaneously at a branching robot arm 5 and then, this approach improves its processing capacity still more.</p> |
