| 摘要 |
<p>Disclosed is a thermosetting composition which can formulate one package and also keeps the above mentioned properties. The thermosetting composition of the present invention comprises (a) a copolymer of a monomer having a polymerizable unsaturated group and an acid anhydride group and a copolymerizable monomer, of which said acid anhydride group is substantially completely half-esterified, half-thioesterified and/or half-amidated, (b) a hydroxy compound having a hydroxy value of 30 to 1,000, and (c) an epoxy compound having an epoxy value of 50 to 1,000.</p> |
