METHOD FOR MANUFACTURING PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICES AND DEVICES OBTAINED THEREBY

摘要

The correct position of the metallic plate supporting the semiconductor chips in the mold used for encapsulation, is performed by at least a pair of locating pins and by locators present in the mold referred to the lead 5 connected to the plate. The ends of the locating pins are spaced, in the final phase of encapsulation, with respect to the surfaces of the plate, whereas in the initial phase they result directly connected to the said metallic surfaces or indirectly connected through the 10 interposition of insulating thicknessings.