发明名称 TRANSFER OF WAX MATERIAL FOR SEMICONDUCTOR ELEMENT DIE BOND
摘要 PURPOSE:To achieve transfer securely and stably by supplying a tape which nearly crosses the surface of a heat sink at right angle to the surface to be die-bonded, allowing a wax material of the tape to oppose to the surface to be die-bonded, and applying the wax material of the tape to the surface to be die-bonded opposing to the die-bond surface. CONSTITUTION:A tape 40, where a wax material is adhered, is supplied to a surface to be die-bonded 21 which is upright to the surface of a heat sink 10 from the direction which is nearly at right angle to the surface of the heat sink 10. Thus, even if the surface to be die-bonded 21 is surrounded by the terminal part of a large number of electrifying lead pins 30, the wax material can be transferred to the surface to be die-bonded 21 without any difficulty. Also, even if a flat surface exists at the upper position from the surface to be bonded 21 at the side of the surface to be die-bonded 21, only the wax material at a specified part of the tape 40 can be securely transferred and the wax material other than that part is not peeled off the base of the tape 40.
申请公布号 JPH0237727(A) 申请公布日期 1990.02.07
申请号 JP19880188899 申请日期 1988.07.28
申请人 SHARP CORP 发明人 ICHIKAWA HIDEKI
分类号 B23K3/06;H01L21/52 主分类号 B23K3/06
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