| 摘要 |
<p>A resin laminate is composed of a heat-sealable layer (A) containing a random copolymer obtainable by copolymerizing ethylene with an alpha -olefin having from 4 to 10 carbon atoms, having a density ranging from 0.900 to 0.920 g/cm<3>, a melt index ranging from 5 to 50 grams per 10 minutes (190 DEG C), and a film thickness ranging from 2 to 15 mu m; and a polyolefinic resin layer (B) having a tensile modulus of 4,000 kg/cm<2> or higher and a melting point higher than that of the heat-sealable layer (A), in which the heat-sealable layer (A) is laminated on the polyolefinic resin layer (B). The resin laminate has an excellent heat sealability and is particularly suitable for packing liquid, powdery or granular matters such as various food, beverages, chemicals and the like.</p> |
