| 发明名称 |
Semiconductor integrated circuit device comprising conductive layers. |
| 摘要 |
<p>A signal interference prevention wiring (13, 14, 15) is disposed between two wirings (11, 12) which are arranged in parallel for transmitting a signal, and the signal interference prevention wiring (13, 14, 15) is held at a constant potential.</p> |
| 申请公布号 |
EP0353426(A2) |
申请公布日期 |
1990.02.07 |
| 申请号 |
EP19890110480 |
申请日期 |
1989.06.09 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TAKAKURA, HIROSHI;IIDA, TETSUYA;GOTO, JUNKEI |
| 分类号 |
H01L23/52;H01L21/3205;H01L23/522;H01L23/528;H01L27/02;H01L29/40 |
主分类号 |
H01L23/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
