MECHANISM FOR DETERMINING SEPARATING POSITION OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To securely cut out a semiconductor device while correcting its position appropriately by providing a rear pressing claw for pressing the semiconductor device from the rear of the cutout and carrying direction after the semiconductor device is cut out. CONSTITUTION:A semiconductor device 1 is cut out by a slide table 3 which permits the semiconductor device 1 to be mounted, sucks it by vacuum and horizontally moves toward the cutout and carrying direction. The semiconductor device 1a which has been cut out on said slide table 3 is pressed from the rear of the cutout and carrying direction by a rear pressing claw 5 which moves horizontally from the rear so that the position of the device is corrected and determined.