| 摘要 |
PURPOSE:To maintain the inside of opening of a press-pressure tool to a specified environment and prevent a lead frame and a wire from being oxidized by forming a gas-guiding path for guiding a reducing or inactive gas at the inner lead part of a semiconductor element and the lead frame exposed within the opening of the press-pressure tool. CONSTITUTION:A press-pressure tool 14, where a semiconductor element S mounted to a lead frame L and an opening for exposing an inner lead part 1 of the lead frame L are formed, has a gas-guiding path for guiding a reducing or inactive gas. Thus, when the press-pressure tool 14 fixes the heated lead frame L with press pressure, it can maintain the semiconductor element S exposed within the opening and the inner lead part I of the lead frame L to a specified environment. It achieves a reliable bonding with a stable and specified bonding strength without oxidizing the lead frame L or a wire W which is easy to be oxidized. |
