Method for circuit repair on integrated circuits and substrates.

摘要

The invention relates to accessing and repairing electrical opens in conducting metal lines on a semiconductor chip or other substrate using laser plating techniques. A maskless means of repairing discontinuities in a conductor disposed on the surface of a substrate is provided wherein the surface is locally irradiated to form a reversible carbonaceous layer thereon. This reversible carbonaceous layer acts as a base for electrodeless deposition of a metal to form a bridge across the discontinuity by laser-enhanced exchange plating or other suitable methods. Further addressed is, a means of accessing and repairing a discontinuity buried by a cover layer of an insulating or passivating material, wherein access to the discontinuity is provided by ablating away the cover layer using a pulsed excimer laser at a first power level.