Method of manufacturing a high-yield solder bumped semiconductor wafer

摘要

Disclosed is a method of manufacturing a high-yield solder bumped semiconductor wafer. The method comprises providing a non-solderable transfer substrate having a transfer surface for receipt of solder material; depositing solder material onto the transfer surface to form solder bumps in a predetermined pattern; aligning solderable conductive elements of a semiconductor wafer with the predetermined solder bumps on the transfer surface; and reflowing the patterned solder bumps into wetted contact with the wafer conductive elements.