| 摘要 |
PURPOSE:To high speedily inspect a fault with high reliability without receiving the influence of some fluctuation of an object pattern by detecting the pattern under a non-contact state using an optical means and examining the connecting relation between pads. CONSTITUTION:The optical image of the pattern to be inspected is converted into an electric signal in an image pickup device 21, the output of the device 21 is inputted through a binarizing device 22 to a connectivity processor 23, and connection data are created. In order to know a pad number when connectivity processing is to be executed, the corresponding relation between a pad position and the pad number is previously created from design information and stored in a pad position data memory 27. The created connection data are stored in a connection data memory 24. On the other hand, design data are previously created from the design information of a circuit pattern and stored in a design data memory 26. After the connection data of all the circuit patterns are created, fault detecting algorithm is executed by a processor 25. |
