| 摘要 |
PURPOSE:To avoid deterioration of reliability of semiconductor element due to moisture penetration and prevent occurrence of cracks in a pellet and a resin by using a lead frame having no island and wire-bonding the semiconductor element to the lead. CONSTITUTION:A peripheral sheet 11 of a pellet 12a located at a predetermined position is fixed to a sheet suction stage 13, and a lead frame 10 having no island is set so that a notch surrounded by leads 2 thereof is positioned above a nozzle 15. Then the pellet lifting nozzle 15 is raised to insert the pellet 12 into the notch of the lead frame 10 and raise it to a predetermined bonding height. Then, after positionally correcting the misregistration amount between each lead 2 of the islandless lead frame 10 and each electrode terminal of the pellet 12a, the electrode terminals of the pellet 12a and the leads of the lead frame 10 are connected through wires 6 by wire bonding and the sheet 11 is removed from the semiconductor element subjected to the bonding. |
