发明名称 INJECTION MOLDING METHOD
摘要 PURPOSE:To improve productivity by shortening a molding cycle by a method wherein a molding material is injected into a clamped mold, solidified through cooling, a molded product is taken out by breaking the mold and ionized compressed air is blown against at least the surface of the mold where the molded product is formed while mold clamping for the next injection molding is being performed. CONSTITUTION:A molding material is injected into a clamped mold 1 and solidified through cooling. Then a molded product 2 is taken out by breaking the mold 1. Then compressed air A ionized by high voltage is blown against the mold 1 and molded product 2 through a nozzle body 15 by a destaticizing blow device 10 while mold clamping for the next injection molding is being performed. With this construction, since static electricity of chips or dregs which are charged with static electricity is neutralized, the chips or dregs, which are generated at the time of injection molding and stuck to the mold 1 and molded product 2 with the static electricity, are blown off with force of the compressed air A, the dregs, chips and molded product 2 are destaticized and the chips and dregs are blown off completely from the mold 1 and molded product 2.
申请公布号 JPH0236915(A) 申请公布日期 1990.02.06
申请号 JP19880187719 申请日期 1988.07.27
申请人 SONY CORP 发明人 EBARA TOSHIYUKI;KOJIMA KATSUMI
分类号 B29C45/00;B29C45/17;B29C45/40 主分类号 B29C45/00
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