发明名称 LOW PRESSURE LIQUID INJECTION MOLDING METHOD FOR SEALING COIL PART OR TRANSFORMER
摘要 PURPOSE:To shorten molding hours and obtain a molded product whose external appearance is favorable by a method wherein a liquid epoxy resin composite is injected with pressure into a mold holding coil parts or a transformer and is in a state of low pressure. CONSTITUTION:Coil parts 3 or a transformer is sealed with a liquid epoxy resin 4 composite by injecting the same into a mold holding the coil parts 3, obtained by winding a conductive wire round a bobbin, or the transformer. The liquid epoxy resin composite is obtained by mixing up liquid epoxy resin with a curing agent, an accelerating agent, a filling agent and/or a fire retardant and it is preferable to contain the filling agent up to 70wt.% and further the fire retardant up to 30wt.%. A degree of vacuum within the mold set up at a temperature not exceeding 140 deg.C is made not exceeding 0.6 Torr and it is preferable since bubbles are not left behind when the degree of vacuum within the mold is regulated at 1-5 Torr simultaneously with starting of injection of the liquid epoxy resin composition.
申请公布号 JPH0236916(A) 申请公布日期 1990.02.06
申请号 JP19880186613 申请日期 1988.07.26
申请人 NIPPON CHIBAGAIGII KK 发明人 ISONO AKIHIKO;MIURA TOMOHARU;NAKAJIMA MASAHIRO
分类号 B29C45/00;B29C45/14;B29K63/00;B29K105/20;B29L31/34 主分类号 B29C45/00
代理机构 代理人
主权项
地址