发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To eliminate uplifting a pellet or shifting its position and to improve the positional accuracy of the pellet by a method wherein recessed parts and protruding parts are formed on a die pad on a package base and the recessed parts are used as grooves for venting use to the outside at a time when a solvent being contained in a paste is turned into gas at the time of heating and curing and is volatilized. CONSTITUTION:A plurality of quadrilateral protruding parts 11 are arranged on a die pad on a package base 5 in a lattice type at proper intervals interposing recessed parts 10 between them. At the time of pellet attachment, a paste 8 is applied on the die pad with the protruding and recessed parts 10 and 11 formed thereon by a potting technique. A pellet 7 is placed on the die pad and the paste 8 is heated and cured by a heating furnace. The parts 10 are used as grooves for venting use and a volatile solvent (gas) in the paste 8 can be released outside of the die pad at the time of pellet attachment.
申请公布号 JPH0236541(A) 申请公布日期 1990.02.06
申请号 JP19880185646 申请日期 1988.07.27
申请人 HITACHI LTD;HITACHI VLSI ENG CORP 发明人 TSUBOI TOSHIHIRO;NISHIUMA MASAHIKO;HONDA ATSUSHI
分类号 H01L21/52 主分类号 H01L21/52
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